Low-pressure injection molding process is a very low pressure (1.5~40bar) encapsulates the material into the mold and fast curing (5-50) method of packaging technology, in order to achieve insulation, temperature resistance, resistance to impact, vibration, moisture-proof, waterproof, dustproof, chemical resistant and corrosion effects. Chinese high-tech the Macromelt technology provides high performance series special hot-melt Adhesive as a packaging material, mainly used in precision, packaging and protection of sensitive electronic components, including printed circuit board (PCB), automotive electronics)